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Skip to Search Results- 21Nanotechnology
- 4Block copolymers
- 4Glancing angle deposition
- 3Lithography
- 3Self-assembly
- 3Thin films
- 2Wu, Nathanael Lap-Yan
- 1Achal, Roshan
- 1Bhuiyan, Abuhanif
- 1Grinek, Stepan
- 1Hawkeye, Matthew Martin
- 1Hosseini Matin, Anahita
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Fall 2011
This work investigates the use of nanoimprint lithography for creating nanoscale resonator devices for applications in mass sensing. A bilayer resist consisting of PMMA 495/LOR 3A allowed the ideal imprint yield for resonators with widths ranging from 300 nm down to 120 nm. Resonators with...
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Fundamentals of Film Growth by Glancing Angle Deposition for Inorganic and Inorganic/Liquid Crystal Hybrid Optical Systems
DownloadFall 2011
This thesis investigates two facets of thin film growth via glancing angle deposition. The first half of the work focuses on the fundamentals of film growth with a focus on uniformity and optical design. This portion of the thesis addresses important engineering questions that are relevant to...
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Fall 2017
Despite offering advantages such as physical flexibility and cost-effectiveness, thin-film optoelectronic devices are held back by their lackluster efficiency in competition with their traditional counterparts. Since one major factor in low performance of these devices is known to be their...
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High Surface Area Nanoelectromechanical Systems via the Integration of Glancing Angle Deposition Thin Films
DownloadFall 2013
High surface area nanoelectromechanical systems (NEMS) are fabricated using glancing angle deposition (GLAD) thin films as the high surface area layer. The GLAD films are deposited on already-released NEMS cantilevers and doubly clamped beams (DCBs) with good uniformity. The resonance frequencies...
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Spring 2011
Graphene is a recently created truly two-dimensional carbon material with promising properties. It is a prospective candidate for the next generation of microelectronics. Current carriers in graphene have relativistic properties, its lattice is very strong and yet flexible, granting...
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Fall 2013
Modern integrated and system-on-chip electronics require high-quality on-chip passive components. Existing inductor designs for microwave and millimetre-wave applications are typically prohibitively large and have low quality factors, requiring circuit designers to avoid integrating them or to...
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Spring 2012
Fabrication of nanofeatures with precisely defined size and ordering is essential for a broad range of technologically important applications, including integrated circuit production. Self-organizing block copolymers are capable of patterning substrates with nanoscale precision. This thesis...
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Spring 2014
The impressive developments in the semiconductor industry over the past five decades have largely been dependent on the ability to continually reduce the dimensions of devices on a chip. However, as critical dimension requirements for these devices approach the limits of photolithography, new...
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Spring 2014
The impressive developments in the semiconductor industry over the past five decades have largely been dependent on the ability to continually reduce the dimensions of devices on a chip. However, as critical dimension requirements for these devices approach the limits of photolithography, new...
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Fall 2015
Dangling Bonds (DBs) on the silicon surface exist when a silicon atom lacks a bonding partner, resulting in a localized orbital which is not involved in any chemical bonds. On the hydrogen-terminated Si(100) surface, such DBs introduce a mid-gap state. DBs can be created on this surface by the...