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Skip to Search Results- 2Arefi, Afshin
- 2Bagheri, Pooya
- 2Banerjee, Bitan
- 2Barczyk, Martin
- 2Barth, Stuart E
- 2Behnam Dehkordi, Mohammad
- 19Machine Learning
- 16Glancing angle deposition
- 15Wireless communication systems.
- 13Nanotechnology
- 12FPGA
- 12MIMO
- 20Musilek, Petr (Electrical and Computer Engineering)
- 20Tellambura, Chintha (Electrical and Computer Engineering)
- 19Ardakani, Masoud (Electrical and Computer Engineering)
- 19Chen, Tongwen (Electrical and Computer Engineering)
- 19Li, Yunwei (Electrical and Computer Engineering)
- 19Reformat, Marek (Electrical and Computer Engineering)
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Spring 2020
With the popularity of smart mobile devices, the need to control mobile devices using voice is increasing. Also, there is greater expectation for the accuracy of keyword spotting. Many existing researches have applied neural networks to keyword spotting, and have great performances. However, at...
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Differential Wye Modular Multilevel AC Converter (DW-M2AC) for Direct AC/AC Power Conversion
DownloadFall 2022
Direct AC/AC MMCs are used in a wide variety of power system applications such as interconnecting asynchronous grids with different frequencies, renewable energy integrations and medium voltage variable frequency motor drives. Due to the advantages such as lower component count and lesser...
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Spring 2013
Highly parallel VLSI implementations of low-density parity-check (LDPC) block code decoders have a large number of interconnections, which can result in designs with low logic density. Bit-serial architectures have been developed that reduce the number of wires needed. However, they do not...
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Fall 2020
With the increase in integrated functionalities within a single chip due to the continuous scaling of the gate length of transistors, off-chip bandwidth must catch up to make the increased functionalities accessible. The future of off-chip bandwidth might reach 100 Tbps according to ITRS...
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Fall 2022
The continuing exponential increase in functionalities of integrated circuits demands high data rate intra-chip and inter-chip communication. However, high speed communications inside silicon chips are often bottlenecked by capacitive drain of the channels. Therefore, as the functionalities of...
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Fall 2012
Glancing angle deposition (GLAD) is a thin film fabrication technique capable of creating arrays of nanocolumns from numerous materials. Optimizing these films for applications requires an understanding of their growth, prompting research into the columns’ growth scaling behaviour. Columns are...