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Advances on Fabrication and Application of Through Silicon Via for Radio Frequency Circuits
DownloadSpring 2019
Through silicon via (TSV) has been considered as an astonishing milestone in the evolution of three-dimensional integrated circuit (3D IC), because of its exclusive and pivotal function of providing signal exchanging paths in the horizontal direction to stacked layers efficiently. Unfortunately,...
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Strategies for Maximizing Signal to Noise in Decoupled Receive Coil Arrays for Magnetic Resonance Imaging
DownloadFall 2013
Designing radio frequency coil arrays for optimal Magnetic Resonance Imaging (MRI) has been a wide area of interest for many years. The optimum coil type for high density arrays and the mitigation of coupling between elements in arrays are significant problems addressed in this thesis. ...
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