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Electromechanical Behaviour of Surface-Bonded Piezoelectric Sensors/Actuators with Imperfect Adhesive Layers

  • Author / Creator
    Jin, Congrui
  • The performance of smart structures depends on the electromechanical behaviour of piezoelectric sensors/actuators and the bonding condition along the interface, which connects the sensor/actuator
    and the host structures. This thesis documents a theoretical study
    of the influence of material parameters of the imperfect bonding
    layer on the coupled electromechanical characteristics of piezoelectric sensors/actuators. A one dimensional sensor/actuator model
    with an imperfect bonding layer, which undergoes a shear deformation, is proposed. The emphasis of the current study is on the local
    stress and strain fields near imperfectly bonded sensors/actuators
    and the load transfer. Analytical solutions based on the integral
    equation method are provided. Detailed numerical simulation is
    conducted to evaluate the influence of the geometry and the material mismatch of the adhesive layer upon the sensing/actuating process. The interfacial debonding and its effect upon the strain/stress
    distribution and the overall performance of the integrated structure
    are evaluated in detail.

  • Subjects / Keywords
  • Graduation date
    Fall 2009
  • Type of Item
    Thesis
  • Degree
    Master of Science
  • DOI
    https://doi.org/10.7939/R3WM7S
  • License
    This thesis is made available by the University of Alberta Libraries with permission of the copyright owner solely for non-commercial purposes. This thesis, or any portion thereof, may not otherwise be copied or reproduced without the written consent of the copyright owner, except to the extent permitted by Canadian copyright law.