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Spring 2015
Permanent wafer bonding technology is a very important process for different types of applications such as MEMS (microelectromechanical systems), LED (light-emitting diode) devices, advanced packaging, 3D stack and SOI (silicon on isolator) substrate applications. Depending on the type of...
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Spring 2012
It is difficult to join high strength alloy steel which are produced by thermo mechanical controlled processing and get overmatched properties on the welds and heat affected zone (HAZ) when submerged arc welding (SAW) is used as joining process. Circumferential welds made in the mill to join...