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Skip to Search Results- 2Chemical Mechanical Planarization
- 2Chemical Mechanical Polishing
- 1CMP
- 1CeO2
- 1Ceria
- 1Colloidal Interaction
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Spring 2012
The chemical mechanical polishing of Copper (Cu-CMP) is a complex and poorly understood process. Despite this, it is widely used throughout the semiconductor and microelectronics industries, and makes up a significant portion of wafer processing costs. In these contexts, desirable polishing...
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Fall 2014
Interactions of finely dispersed abrasive particles in chemical mechanical planarization (CMP) slurries play a vital role in determining the polishing performance. In this study, coupled influence of hydrodynamic and colloidal interactions on the attachment of nanosized ceria (CeO2) particles to...