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- 1Chemical Mechanical Planarization
- 1Chemical Mechanical Polishing
- 1Colloidal Interaction
Interactions of finely dispersed abrasive particles in chemical mechanical planarization (CMP) slurries play a vital role in determining the polishing performance. In this study, coupled influence of hydrodynamic and colloidal interactions on the attachment of nanosized ceria (CeO2) particles to...