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Advances on Fabrication and Application of Through Silicon Via for Radio Frequency Circuits
DownloadSpring 2019
Through silicon via (TSV) has been considered as an astonishing milestone in the evolution of three-dimensional integrated circuit (3D IC), because of its exclusive and pivotal function of providing signal exchanging paths in the horizontal direction to stacked layers efficiently. Unfortunately,...
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Miniaturization of Microwave to Millimeter-Wave Integrated Waveguides and their Applications
DownloadFall 2019
The integration of waveguide technology at the planar level has been a crucial development for the successful realization of 5G, the future fifth generation cellular network. The demand for mobile networks with faster speeds, lower latencies, and denser connectivity scenarios continues to drive...