This decommissioned ERA site remains active temporarily to support our final migration steps to https://ualberta.scholaris.ca, ERA's new home. All new collections and items, including Spring 2025 theses, are at that site. For assistance, please contact erahelp@ualberta.ca.
Search
Skip to Search Results
Filter
Subject / Keyword
- 1CMP
- 1CeO2
- 1Ceria
- 1Chemical Mechanical Planarization
- 1Chemical Mechanical Polishing
- 1Colloidal Interaction
Item type
Supervisors
Author / Creator / Contributor
Year
Collections
Languages
-
Fall 2014
Interactions of finely dispersed abrasive particles in chemical mechanical planarization (CMP) slurries play a vital role in determining the polishing performance. In this study, coupled influence of hydrodynamic and colloidal interactions on the attachment of nanosized ceria (CeO2) particles to...
1 - 1 of 1