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Skip to Search Results- 2Chemical mechanical polishing
- 1Boron doped polysilicon
- 1Colloidal stability
- 1Lubrication
- 1Mixed abrasive slurries
- 1Settling
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A study of the colloidal stability of mixed abrasive slurries of silica and ceria nanoparticles for chemical mechanical polishing
DownloadFall 2011
Slurry stability is an important factor in Chemical Mechanical Polishing (CMP) efficiency. However, few studies have been done in this respect. In settling tests at pH 4, adding various amounts of ceria to colloidal silica slurries was shown to change the stability of the resulted mixed abrasive...
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Study of the High Rate Chemical Mechanical Polishing of Heavily Boron-doped Polysilicon for 3D Applications
DownloadFall 2014
The chemical mechanical polishing of polysilicon is a complex process and is not well understood. Despite this, it is used in the semiconductor industry for applications such as via filling and 3D packaging. Although the doping of polysilicon enables applying a wide range of conductivities,...