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DNA-assisted Heterogeneous Integration of Micro- and Nanoelectronic Devices: Modeling, Control, and Rational Design of Selective Attachment
DownloadSpring 2018
Heterogeneous integration is an electronic packaging approach that enables the fabrication and assembly of complete electronic subsystems from components fabricated with different substrates and processes. Current commercial techniques like robotic pick-and-place, fluidic self-assembly, and...
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Fall 2014
Electrons, the fundamental charge carriers in solid-state devices, possess three intrinsic properties: mass, charge and spin. Spin is a quantum mechanical property, but can be loosely visualized as a tiny “intrinsic” magnetic dipole moment attached to an electron. In conventional electron...
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Using Biomolecular Recognition to Selectively Self-Assemble Microscale Components onto Patterned Substrates
DownloadSpring 2015
Modern nanofabrication technology in the 21st century has continued year after year to push the boundaries of what is possible at the nanoscale. With the advent of molecular electronics, single electron devices, nanoelectromechanical systems (NEMS), and other nanotechnologies, the near future...