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Development of a MEMS 3D Stress Sensor Using Strain Engineering for Out of Plane Stress Applications
DownloadSpring 2020
This work aims to enhance the performance of a MEMS-based 3D piezoresistive sensor, which has the capability of extracting the six temperature-compensated stress components. That sensor is made of an n-type piezoresistive element that has low pressure/out-of-plane piezoresistive (PR) coefficient,...
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