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Skip to Search Results- 2Brett, Michael J. (Electrical and Computer Engineering)
- 2Buriak, Jillian M. (Chemistry)
- 1Daneshmand, Mojgan (Electrical and Computer Engineering)
- 1DeCorby, Ray (Electrical and Computer Engineering)
- 1Dew, Steven K (Electrical and Computer Engineering)
- 1Fleck, Brain (Mechanical Engineering)
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DNA-assisted Heterogeneous Integration of Micro- and Nanoelectronic Devices: Modeling, Control, and Rational Design of Selective Attachment
DownloadSpring 2018
Heterogeneous integration is an electronic packaging approach that enables the fabrication and assembly of complete electronic subsystems from components fabricated with different substrates and processes. Current commercial techniques like robotic pick-and-place, fluidic self-assembly, and...
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Fall 2010
This thesis describes the fabrication and characterization of integrated hollow Bragg waveguides fabricated by controlled thin film buckling. Hollow waveguides based on two different set of materials were studied. In the first case, thermal tuning of air-core dimensions was studied using...
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Miniaturization of Microwave to Millimeter-Wave Integrated Waveguides and their Applications
DownloadFall 2019
The integration of waveguide technology at the planar level has been a crucial development for the successful realization of 5G, the future fifth generation cellular network. The demand for mobile networks with faster speeds, lower latencies, and denser connectivity scenarios continues to drive...
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Spring 2014
The impressive developments in the semiconductor industry over the past five decades have largely been dependent on the ability to continually reduce the dimensions of devices on a chip. However, as critical dimension requirements for these devices approach the limits of photolithography, new...
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Spring 2014
The impressive developments in the semiconductor industry over the past five decades have largely been dependent on the ability to continually reduce the dimensions of devices on a chip. However, as critical dimension requirements for these devices approach the limits of photolithography, new...
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Fall 2014
Electrons, the fundamental charge carriers in solid-state devices, possess three intrinsic properties: mass, charge and spin. Spin is a quantum mechanical property, but can be loosely visualized as a tiny “intrinsic” magnetic dipole moment attached to an electron. In conventional electron...