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Advances on Fabrication and Application of Through Silicon Via for Radio Frequency Circuits
DownloadSpring 2019
Through silicon via (TSV) has been considered as an astonishing milestone in the evolution of three-dimensional integrated circuit (3D IC), because of its exclusive and pivotal function of providing signal exchanging paths in the horizontal direction to stacked layers efficiently. Unfortunately,...
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Fall 2019
This thesis describes the design, fabrication, and characterization of 3D superconducting microwave cavities for two applications. It first describes a cryogenically compatible microwave filter that is able to tune its resonant frequency by an unprecedented 5 GHz via deformation caused by a a...
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Fall 2020
Infectious respiratory diseases, caused by viruses and bacteria that attack the respiratory system, constitute a serious threat in public health around the world. Pathogens can be transmitted in the air though large droplets or aerosols. As aerosols can linger in the environment for a prolonged...