Search
Skip to Search Results
Filter
Subject / Keyword
Collections
Author / Creator / Contributor
Year
Languages
Item type
-
Spring 2012
The chemical mechanical polishing of Copper (Cu-CMP) is a complex and poorly understood process. Despite this, it is widely used throughout the semiconductor and microelectronics industries, and makes up a significant portion of wafer processing costs. In these contexts, desirable polishing...
-
Rheology of Bitumen at the Onset of Asphaltene Aggregation and its Effects on the Stability of Water-in-Oil Emulsion
DownloadFall 2015
Asphaltenes are the heaviest fraction of bitumen. Asphaltenes not only play an important role in the high viscosity of bitumen but also in the water-in-oil (W/O) emulsion stability. Nevertheless, their exact function in the stability mechanism of W/O emulsion still remains unresolved. It is...
1 - 2 of 2