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Author / Creator / Contributor

1Qiu, Yang

Languages

1English

Subject / Keyword

1Conductive Polymer
1Filter
1Radio Frequency
1Silicon Interposer
1Substrate Integrated Waveguide
1Through Silicon Via

Year

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1Graduate and Postdoctoral Studies (GPS), Faculty of
1Graduate and Postdoctoral Studies (GPS), Faculty of/Theses and Dissertations

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1Thesis

Departments

1Department of Mechanical Engineering

Supervisors

1Pedram Mousavi (Mechanical Engineering)
1Walied Moussa (Mechanical Engineering)

Advances on Fabrication and Application of Through Silicon Via for Radio Frequency Circuits
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Spring 2019

Qiu, Yang

Through silicon via (TSV) has been considered as an astonishing milestone in the evolution of three-dimensional integrated circuit (3D IC), because of its exclusive and pivotal function of providing signal exchanging paths in the horizontal direction to stacked layers efficiently. Unfortunately,...

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Advances on Fabrication and Application of Through Silicon Via for Radio Frequency Circuits