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Permanent link (DOI): https://doi.org/10.7939/R39C6S59T

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Geckofluidics: A strong and reliable reversible bonding technique for microfluidics Open Access

Descriptions

Other title
Subject/Keyword
Gecko inspired adhesives
microfluidic chip bonding
reversible adhesion
Microfluidics
Type of item
Thesis
Degree grantor
University of Alberta
Author or creator
,Abdul Wasay
Supervisor and department
Sameoto, Dan
Examining committee member and department
Elias, Anastasia (Chemical Engineering)
Tsai, Peichun Amy (Mechanical Engineering)
Department
Department of Mechanical Engineering
Specialization

Date accepted
2016-03-09T11:24:24Z
Graduation date
2016-06
Degree
Master of Science
Degree level
Master's
Abstract
Towards minimizing the cost of Micro Total Analysis Systems(µTAS) or Lab on a chip (LoC) systems, it is important to minimize manufacturing and assembly cost and time, and lower material costs. While the choice of material does govern material costs and the manufacturing process required and thereby, the time, it has been observed that the assembly(bonding) and interfacing time is one of the major rate limiting stepsfor the entire process. This work is an attempt to introduce a new bonding technique for microfluidics by using synthetic gecko inspired adhesives. This technique is being referred to as Geckofluidics. It doesn’t require the use of any solvents or glues or surface activation or application of high pressure and/or temperature and is achievable in a process which doesn’t require any additional equipment or add to the cost. It provides for a strong and reliable, reversible bonding technique, with bond strengths being on par with traditional irreversible bond strengths in elastomers. This work characterizes the manufacturing feasibility of geckofluidic devices with various thermoplastic elastomers. A finite element simulation was also implemented inorder to study the effect of some of the remedial measures taken to improve the adhesion strength, and also to study the minimum number of adhesive features required to effectively support the integration with microfluidics.A rapid mass manufacturing technique is also demonstrated using thermocompressive molding in thermoplastic elastomers. The resulting devices have been demonstrated for use for both pressurized and non-pressurized microfluidic systems against various substrates.
Language
English
DOI
doi:10.7939/R39C6S59T
Rights
This thesis is made available by the University of Alberta Libraries with permission of the copyright owner solely for the purpose of private, scholarly or scientific research. This thesis, or any portion thereof, may not otherwise be copied or reproduced without the written consent of the copyright owner, except to the extent permitted by Canadian copyright law.
Citation for previous publication
WASAY, A; SAMEOTO, D. Gecko gaskets for self-sealing and high-strength reversible bonding of microfluidics. LAB ON A CHIP. 15, 13, 2749-2753, 2015. ISSN: 14730197.D. Sameoto ; A. Wasay; Materials selection and manufacturing of thermoplastic elastomer microfluidics . Proc. SPIE 9320, Microfluidics, BioMEMS, and Medical Microsystems XIII, 932001 (March 5, 2015); doi:10.1117/12.2081291.

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