The flexural creep behavior of OSB panels under various climatic conditions

• Author(s) / Creator(s)

  • Zhao, Naiwen.
  • Cheng, J. J. Roger
  • Bach, Lars

• Structural engineering report SER 199 | SER-ID SER199

• Date created

  1994

• Subjects / Keywords

  • Waferboard--Environmental testing
  • Waferboard--Creep
  • Waferboard--Testing

• Type of Item

  Report

• DOI

  https://doi.org/10.7939/R34B2X54N

• License

  This work is made available under the terms of the Creative Commons Attribution-Non-Commercial 3.0 Unported license, http://creativecommons.org/licenses/by-nc/3.0/.