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The structure and composition of an electroplated gold-tin solder alloy co-deposited by pulse plating from solutions containing ethylenediamine as a stabilizer
- Author / Creator
- Doesburg, Jacobus Cornelis.
- Graduation date
- Type of Item
- Master of Science in Materials Engineering
- This thesis is made available by the University of Alberta Libraries with permission of the copyright owner solely for non-commercial purposes. This thesis, or any portion thereof, may not otherwise be copied or reproduced without the written consent of the copyright owner, except to the extent permitted by Canadian copyright law.