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The structure and composition of an electroplated gold-tin solder alloy co-deposited by pulse plating from solutions containing ethylenediamine as a stabilizer

  • Author / Creator
    Doesburg, Jacobus Cornelis.
  • Graduation date
    2000
  • Type of Item
    Thesis
  • Degree
    Master of Science in Materials Engineering
  • DOI
    https://doi.org/10.7939/R3PV6BG7R
  • License
    This thesis is made available by the University of Alberta Libraries with permission of the copyright owner solely for non-commercial purposes. This thesis, or any portion thereof, may not otherwise be copied or reproduced without the written consent of the copyright owner, except to the extent permitted by Canadian copyright law.
  • Language
    English
  • Institution
    University of Alberta
  • Degree level
    Master's
  • Department
    • Department of Chemical and Materials Engineering