THERMOHYDRAULIC PERFORMANCE OF LIQUID METALS BASED MICROCHANNEL HEAT SINK USING NUMERICAL APPROACH

• Author(s) / Creator(s)

  • Agarwal, Rahul
  • Mohamad, A.A.

• The continuous miniaturization of microchips in semiconductor industries has been posing a challenge on microscale thermal management systems for removal of high heat flux. Traditional air-cooling methods cannot meet the demands for heat dissipation for integrated circuits. In this regard, microchannel heat sinks constitute an innovative cooling technology as it manifest attributes, such as high surface–to–volume ratio, high heat dissipation capabilities, and lower coolant requirements. Due to such inherent advantages, microchannel heat sinks have received considerable attention, since the pioneering study of Tuckerman and Pease. Hence, in the present work, various liquid metals are employed as coolant in order to quantitatively evaluate the thermal and hydraulic performance of a microchannel heat sink. A three-dimensional model of microchannel heat sink is developed for numerically analyzing heat transfer and fluid–flow characteristics with determination of temperature field in both solid and liquid regions, along with pumping power for coolant flow. The present study employs liquid metal – Gallium and its alloys and compared with traditional coolant (water).

  Part of the Proceedings of the Canadian Society for Mechanical Engineering International Congress 2022.

• Date created

  2022-06-01

• Subjects / Keywords

  • microchannel heat sink
  • liquid metals
  • gallium
  • conjugate heat transfer

• Type of Item

  Article (Published)

• DOI

  https://doi.org/10.7939/r3-v1bq-k524

• License

  Attribution-NonCommercial 4.0 International