Investigation of methods of through silicon via filling using conductive paste and silver nanowires

• Author(s) / Creator(s)

  • Abraham, Rosmi
  • Liu, David
  • Chung, Hyun Joong
  • Park, Byoungyoul

• Conference abstract. Part of the Proceedings of the Canadian Society for Mechanical Engineering International Congress 2022.

• Date created

  2022-06-01

• Subjects / Keywords

  • abstract

• Type of Item

  Research Material

• DOI

  https://doi.org/10.7939/r3-20r5-7m58

• License

  Attribution-NonCommercial 4.0 International