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Study on Ni/Cu Alloy Plating and Pure Nickel Electrodeposition in Magnetic Fields
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- Author / Creator
- Wang, Tianfei
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The processes of Ni/Cu electro-co-deposition and pure nickel electroplating in magnetic field
have been investigated. Various techniques such as scanning electron microscope (SEM), atomic
force microscope (AFM), X-ray diffractometer (XRD), and electrochemical characterization
were used to determine the characteristics of electro-deposition. A reliable method has been
developed to fabricate Ni/Cu coating film with uniform composition. The color of Ni/Cu
deposits was found to be related to the residual stresses in the deposits, which could be altered by
adjusting the pH level of the solution. The magneto-electrolytic deposition study found that
MHD stirring in the bulk electrolyte has limited influence on the coating properties; however,
MHD effect in the fluid boundary layer could modify the morphology and structure of the
deposits. Three new models were proposed to interpret the underlying mechanisms on
morphology and texture formation during nickel deposit in both parallel and vertical magnetic
fields. The effect of the alternative magnetic field generated by spinning magnets on nickel
deposition was also investigated and the coatings with better surface smoothness than static
magnetic field had been achieved. The micro-hardness of the deposited nickel samples made in
the absence and presence of magnetic field were evaluated. The hardness of the deposits can be
well correlated to the surface roughness through a Hall-Petch-type relationship. -
- Subjects / Keywords
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- Graduation date
- Spring 2015
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- Type of Item
- Thesis
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- Degree
- Doctor of Philosophy
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- License
- This thesis is made available by the University of Alberta Libraries with permission of the copyright owner solely for non-commercial purposes. This thesis, or any portion thereof, may not otherwise be copied or reproduced without the written consent of the copyright owner, except to the extent permitted by Canadian copyright law.