Search
Skip to Search Results- 3CMOS
- 1Active Inductor
- 1Bandwidth-Extended
- 1Beta-multiplier
- 1CBCPW Electromagnetics Simulation
- 1CMOS
-
Spring 2014
Wireless sensing of abnormal intraocular pressure (IOP) levels associated with Glaucoma, a leading cause of blindness, was first proposed in the late 1960’s. While much research has been applied in the intervening time, a suitable commercially available wireless IOP monitoring instrument remains...
-
Spring 2011
Inductors are extensively used in the design of radio-frequency circuits. In the last decade, the integration of passive components, especially inductors on silicon chips, has led to the widespread development and implementation of Radio Frequency Integrated Circuits (RFICs) in CMOS technologies....
-
Fall 2020
The semiconductor industry strives to develop ultra-low power circuits and systems because of the ever-increasing consumer demand for more functionality and longer battery life for portable electronic devices. Subthreshold operation brings both reduced power consumption through lower voltage...
-
Spring 2019
The bandwidth equipment for future high-data-rate wireless communication systems can only be met by development of these systems at millimeter wave frequencies and beyond because of bandwidth scarcity in crowded low GHz frequencies. In the millimeter wave spectrum, 60-GHz band offers 7-GHz of...
-
Spring 2021
Ultra-wideband (UWB) technology has attracted the attention of the industry and research community since the 3.1-10.6 GHz band spectral regulation was declassified for commercial use by the Federal Communications Commission (FCC) in 2002. UWB technology has positioned itself as a promising...
-
Radio Frequency Characterization and Modelling of Low Temperature Co-Fired Ceramic (LTCC) Material and Devices
DownloadSpring 2014
The focus of this dissertation is on the characterization of Low Temperature Co-fired Ceramic (LTCC) for microwave and Radio Frequency (RF) applications. The LTCC substrates’ excellent microwave properties make them great candidates for the packaging of RF devices, as well as the fabrication of...