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Advances on Fabrication and Application of Through Silicon Via for Radio Frequency Circuits
DownloadSpring 2019
Through silicon via (TSV) has been considered as an astonishing milestone in the evolution of three-dimensional integrated circuit (3D IC), because of its exclusive and pivotal function of providing signal exchanging paths in the horizontal direction to stacked layers efficiently. Unfortunately,...
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Spring 2012
Multi-electrode arrays are essential tools to interface with the nervous system. The development of a flexible-based electrode array used to interface with the spinal cord is reported. A 2D finite element model (FEM) was developed to characterize the design parameters of such an array. A...