ERA

Download the full-sized PDF of Electromechanical Behaviour of Surface-Bonded Piezoelectric Sensors/Actuators with Imperfect Adhesive LayersDownload the full-sized PDF

Analytics

Share

Permanent link (DOI): https://doi.org/10.7939/R3WM7S

Download

Export to: EndNote  |  Zotero  |  Mendeley

Communities

This file is in the following communities:

Graduate Studies and Research, Faculty of

Collections

This file is in the following collections:

Theses and Dissertations

Electromechanical Behaviour of Surface-Bonded Piezoelectric Sensors/Actuators with Imperfect Adhesive Layers Open Access

Descriptions

Other title
Subject/Keyword
Piezoelectric
Modelling
Sensor
Actuator
Type of item
Thesis
Degree grantor
University of Alberta
Author or creator
Jin, Congrui
Supervisor and department
Zuo, Mingjian (Mechanical Engineering)
Wang, Xiaodong (Mechanical Engineering)
Examining committee member and department
Wang, Xiaodong (Mechanical Engineering)
Li, Dongyang (Chemical Engineering)
Schiavone, Peter (Mechanical Engineering)
Zuo, Mingjian (Mechanical Engineering)
Department
Department of Mechanical Engineering
Specialization

Date accepted
2009-08-27T15:04:33Z
Graduation date
2009-11
Degree
Master of Science
Degree level
Master's
Abstract
The performance of smart structures depends on the electromechanical behaviour of piezoelectric sensors/actuators and the bonding condition along the interface, which connects the sensor/actuator and the host structures. This thesis documents a theoretical study of the influence of material parameters of the imperfect bonding layer on the coupled electromechanical characteristics of piezoelectric sensors/actuators. A one dimensional sensor/actuator model with an imperfect bonding layer, which undergoes a shear deformation, is proposed. The emphasis of the current study is on the local stress and strain fields near imperfectly bonded sensors/actuators and the load transfer. Analytical solutions based on the integral equation method are provided. Detailed numerical simulation is conducted to evaluate the influence of the geometry and the material mismatch of the adhesive layer upon the sensing/actuating process. The interfacial debonding and its effect upon the strain/stress distribution and the overall performance of the integrated structure are evaluated in detail.
Language
English
DOI
doi:10.7939/R3WM7S
Rights
License granted by Congrui Jin (congrui@ualberta.ca) on 2009-08-26T19:16:05Z (GMT): Permission is hereby granted to the University of Alberta Libraries to reproduce single copies of this thesis and to lend or sell such copies for private, scholarly or scientific research purposes only. Where the thesis is converted to, or otherwise made available in digital form, the University of Alberta will advise potential users of the thesis of the above terms. The author reserves all other publication and other rights in association with the copyright in the thesis, and except as herein provided, neither the thesis nor any substantial portion thereof may be printed or otherwise reproduced in any material form whatsoever without the author's prior written permission.
Citation for previous publication

File Details

Date Uploaded
Date Modified
2014-04-30T21:54:05.156+00:00
Audit Status
Audits have not yet been run on this file.
Characterization
File format: pdf (Portable Document Format)
Mime type: application/pdf
File size: 592267
Last modified: 2015:10:12 16:23:46-06:00
Filename: Jin_Congrui_Fall2009.pdf
Original checksum: e075f34da57002caf1c1279cc80015a2
Well formed: true
Valid: true
File title: t.pdf
File title: University of Alberta
File author: Faculty of Graduate Studies and Research
Page count: 97
Activity of users you follow
User Activity Date