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Permanent link (DOI): https://doi.org/10.7939/R3WP4B

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Electrodeposition of Pb-free, Sn-based Alloy Solder Films Open Access

Descriptions

Other title
Subject/Keyword
Pb-Sn alloys
Type of item
Thesis
Degree grantor
University of Alberta
Author or creator
Han, Chunfen
Supervisor and department
Liu, Qi (Chemical and Materials Engineering)
Ivey, Douglas (Chemical and Materials Engineering)
Examining committee member and department
Nychka, John (Chemical and Materials Engineering)
Sit, Jeremy (Electrical and Computer Engineering)
Barkey, Dale (Chemical Engineering, University of New Hampshire)
Chen, Weixing (Chemical and Materials Engineering)
Department
Department of Chemical and Materials Engineering
Specialization

Date accepted
2009-05-04T20:24:39Z
Graduation date
2009-11
Degree
Doctor of Philosophy
Degree level
Doctoral
Abstract
The dominant materials used for solders in electronic assemblies over the past 60 years have been Pb-Sn alloys. Increasing pressure from environmental and health authorities has stimulated the development of various Pb-free solders. Two of the most promising replacements are eutectic Sn-Cu and Sn-Ag-Cu alloys that are produced primarily by electrodeposition. During soldering and solid state aging (storage or in service of the electronic assemblies), interactions take place at the solder/substrate metal interface and form intermetallic compounds (IMCs) which are crucial for the reliability of the solder joints. Simple and "green" Sn-citrate and Sn-Cu-citrate solutions have been developed and optimized to electrodeposit eutectic and near eutectic Sn-Cu solder films. Sn-citrate suspensions with Cu particles and Sn-Cu-citrate suspensions with Ag nano-particles have also been developed and optimized to allow for electrochemical composite deposition of eutectic and near eutectic Sn-Cu and Sn-Ag-Cu solder films. Different plating and post-plating conditions, including solution concentration, current density, agitation, additives, and aging, have been investigated by evaluating their effects on plating rate, deposit composition and microstructure. Tri-ammonium citrate is used as the only complexing agent for Sn, Sn-Cu, and Sn-Ag-Cu deposition. Speciation diagram calculations, reduction potential calculations, and polarization studies are conducted to study Sn-citrate solution chemistry and the kinetics of Sn electrodeposition. X-ray photoelectron spectroscopy (XPS) analysis is used to identify the precipitates formed in Sn-citrate solutions at low pH. Current-controlled and potential-controlled electrochemical techniques, nucleation modeling, and surface morphology characterization techniques are applied to study the nucleation and film growth mechanism of Sn and Sn-Cu electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Reflow and aging tests for deposited Sn-Cu and Sn-Ag-Cu solder films on Cu and Ni substrates are performed to study the interactions between the solder and the substrate and the formation and growth of IMCs at the solder/substrate interface, by characterizing the microstructure of the IMCs and calculating diffusion coefficients.
Language
English
DOI
doi:10.7939/R3WP4B
Rights
Permission is hereby granted to the University of Alberta Libraries to reproduce single copies of this thesis and to lend or sell such copies for private, scholarly or scientific research purposes only. Where the thesis is converted to, or otherwise made available in digital form, the University of Alberta will advise potential users of the thesis of these terms. The author reserves all other publication and other rights in association with the copyright in the thesis and, except as herein before provided, neither the thesis nor any substantial portion thereof may be printed or otherwise reproduced in any material form whatsoever without the author's prior written permission.
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