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Permanent link (DOI): https://doi.org/10.7939/R3SB3X66B

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Attachment of CeO2 and SiO2 for Chemical Mechanical Polishing: Theory and Experiments Open Access

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Other title
Attachment of Ceria and Silica for Chemical Mechanical Polishing: Theory and Experiments
Subject/Keyword
XDLVO
Colloidal Interaction
CeO2
Hydrodynamic Interaction
DLVO
Silica
Mixed Abrasive Slurry
Quartz Crystal Microbalance
QCM-D
Chemical Mechanical Polishing
CMP
Deposition Rate
Sauerbrey
Ceria
Chemical Mechanical Planarization
SiO2
Type of item
Thesis
Degree grantor
University of Alberta
Author or creator
Rafie Borujeny, Elham
Supervisor and department
Xu, Zhenghe (Chemical and Materials Engineering)
Cadien, Kenneth C. (Chemical and Materials Engineering)
Examining committee member and department
Xu, Zhenghe (Chemical and Materials Engineering)
Pick, William (Chemical and Materials Engineering)
Rajender, Gupta (Chemical and Materials Engineering)
Cadien, Kenneth C. (Chemical and Materials Engineering)
Department
Department of Chemical and Materials Engineering
Specialization
Chemical Engineering
Date accepted
2014-09-10T11:18:47Z
Graduation date
2014-11
Degree
Master of Science
Degree level
Master's
Abstract
Interactions of finely dispersed abrasive particles in chemical mechanical planarization (CMP) slurries play a vital role in determining the polishing performance. In this study, coupled influence of hydrodynamic and colloidal interactions on the attachment of nanosized ceria (CeO2) particles to a silica (SiO2) surface is investigated. Deposition rates of ceria nanoparticles on silica sensor are determined using quartz crystal microbalance with dissipation monitoring (QCM-D) as a model system and compared with theoretical transport models under the influence of colloidal interactions. It is found that the deposition of ceria nanoparticles on silica is highly dependent on the solution pH, fluid velocity, and concentration of ceria particles in the solution. The system is shown to exhibit considerably different behaviors at acidic and basic pH conditions. More specifically, stronger attachment occurs at neutral pH conditions than at acidic or basic conditions. The concentration of particles is also shown to affect the interaction of ceria with silica in a complex way which is not necessarily predictable by the simplified theories of colloidal interactions. More specifically, increasing ceria bulk concentration within some ranges results in decreasing the initial deposition rate.
Language
English
DOI
doi:10.7939/R3SB3X66B
Rights
Permission is hereby granted to the University of Alberta Libraries to reproduce single copies of this thesis and to lend or sell such copies for private, scholarly or scientific research purposes only. Where the thesis is converted to, or otherwise made available in digital form, the University of Alberta will advise potential users of the thesis of these terms. The author reserves all other publication and other rights in association with the copyright in the thesis and, except as herein before provided, neither the thesis nor any substantial portion thereof may be printed or otherwise reproduced in any material form whatsoever without the author's prior written permission.
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